Type | Description |
---|---|
Series: | Lo-PRO®file, 513 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 18 (2 x 9) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | -55°C ~ 105°C |
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14-3518-101HAries Electronics, Inc. |
CONN IC DIP SOCKET 14POS GOLD |
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346-93-122-41-013000Mill-Max |
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26-3513-10Aries Electronics, Inc. |
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36-0518-10HAries Electronics, Inc. |
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36-1518-10HAries Electronics, Inc. |
CONN IC DIP SOCKET 36POS GOLD |
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