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| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 36 (2 x 18) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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CONN SOCKET SIP 16POS GOLD |
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CONN IC DIP SOCKET 6POS GOLD |
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29-0518-10TAries Electronics, Inc. |
CONN SOCKET SIP 29POS GOLD |
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32-0518-10Aries Electronics, Inc. |
CONN SOCKET SIP 32POS GOLD |
In Stock: 0 $2.94789 |
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32-1518-10Aries Electronics, Inc. |
CONN IC DIP SOCKET 32POS GOLD |
In Stock: 0 $2.94789 |
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04-0508-21Aries Electronics, Inc. |
CONN SOCKET SIP 4POS GOLD |
In Stock: 0 $2.94789 |
