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ICF-318-T-O

ICF-318-T-O

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Manufacturer Part
ICF-318-T-O
Manufacturer
Samtec, Inc.
Description
CONN IC DIP SOCKET 18POS TIN
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
6315
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:iCF
Package:Tube
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:-
Contact Material - Mating:Beryllium Copper
Mounting Type:Surface Mount
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:-
Contact Material - Post:Beryllium Copper
Housing Material:Liquid Crystal Polymer (LCP)
Operating Temperature:-55°C ~ 125°C

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