Type | Description |
---|---|
Series: | 114 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 36 (2 x 18) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Surface Mount |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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CONN IC DIP SOCKET 32POS GOLD |
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10-0513-11Aries Electronics, Inc. |
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114-87-648-41-117101Preci-Dip |
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116-87-428-41-012101Preci-Dip |
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