Type | Description |
---|---|
Series: | 116 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 20 (2 x 10) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Elevated, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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115-83-632-41-003101Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD |
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116-87-310-41-013101Preci-Dip |
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In Stock: 0 $1.65444 |
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116-87-422-41-008101Preci-Dip |
CONN IC DIP SOCKET 22POS GOLD |
In Stock: 0 $1.65513 |
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510-87-066-11-002101Preci-Dip |
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In Stock: 0 $1.65699 |
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116-87-432-41-006101Preci-Dip |
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In Stock: 0 $1.65742 |
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110-83-632-41-005101Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD |
In Stock: 0 $1.65818 |
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110-83-632-41-605101Preci-Dip |
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In Stock: 0 $1.65818 |
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ICA-318-STTSamtec, Inc. |
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