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508-AG10D-ES

508-AG10D-ES

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Manufacturer Part
508-AG10D-ES
Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 8POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
5387
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:500
Package:Bulk
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Copper Alloy
Housing Material:Polyester
Operating Temperature:-55°C ~ 125°C

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