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| Type | Description |
|---|---|
| Series: | Lo-PRO®file, 526 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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209-PGM17020-10Aries Electronics, Inc. |
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222-3343-00-0602J3M |
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24-6554-16Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 24POS |
In Stock: 102 $42.40000 |
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236-6225-00-06023M |
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44-547-11EAries Electronics, Inc. |
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In Stock: 1 $173.75000 |
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123-47-308-41-001000Mill-Max |
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110-47-628-41-605000Mill-Max |
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