| Type | Description |
|---|---|
| Series: | 800 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 40 (2 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 25.0µin (0.63µm) |
| Contact Material - Post: | Copper |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
110-43-640-41-801000Mill-Max |
CONN IC DIP SOCKET 40POS GOLD |
In Stock: 30 $10.07000 |
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16-810-90CAries Electronics, Inc. |
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12-810-90CAries Electronics, Inc. |
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18-6810-90TAries Electronics, Inc. |
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110-13-640-41-801000Mill-Max |
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714-43-264-31-018000Mill-Max |
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40-6823-90Aries Electronics, Inc. |
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268-5401-00-1102JH3M |
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242-1281-00-0602J3M |
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