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| Type | Description |
|---|---|
| Series: | 800 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Copper |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 105°C |
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|---|---|---|---|
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115-43-624-41-003000Mill-Max |
CONN IC DIP SOCKET 24POS GOLD |
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111-93-316-41-001000Mill-Max |
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24-3518-10Aries Electronics, Inc. |
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123-47-314-41-001000Mill-Max |
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214-44-320-01-670800Mill-Max |
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