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| Type | Description |
|---|---|
| Series: | Vertisockets™ 800 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 10 (2 x 5) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole, Right Angle, Vertical |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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24-6554-10Aries Electronics, Inc. |
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40-6554-11Aries Electronics, Inc. |
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228-4817-00-0602J3M |
CONN IC DIP SOCKET ZIF 28POS GLD |
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224-5248-00-0602J3M |
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0804MCTexas Instruments |
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214-7390-55-19023M |
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228-1371-00-0602J3M |
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