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| Type | Description |
|---|---|
| Series: | 8400 |
| Package: | Tube |
| Part Status: | Active |
| Type: | PLCC |
| Number of Positions or Pins (Grid): | 44 (4 x 11) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 160.0µin (4.06µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 160.0µin (4.06µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature: | -40°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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18-3518-10Aries Electronics, Inc. |
CONN IC DIP SOCKET 18POS GOLD |
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115-43-316-41-003000Mill-Max |
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8452-11B1-RK-TP3M |
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110-47-640-41-001000Mill-Max |
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