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| Type | Description |
|---|---|
| Series: | Textool™ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SOIC |
| Number of Positions or Pins (Grid): | 16 (2 x 8) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES), Glass Filled |
| Operating Temperature: | -55°C ~ 150°C |
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|---|---|---|---|
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240-1288-00-0602J3M |
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200-6313-9UN-19003M |
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200-6315-9UN-19003M |
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225-PRS15001-12Aries Electronics, Inc. |
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ICS-624-TAdam Tech |
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