| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 25.0µin (0.63µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
110-13-628-41-801000Mill-Max |
CONN IC DIP SOCKET 28POS GOLD |
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299-93-618-10-002000Mill-Max |
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299-43-618-10-002000Mill-Max |
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828-AG11DTE Connectivity AMP Connectors |
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1-1571550-0TE Connectivity AMP Connectors |
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506-AG10DTE Connectivity AMP Connectors |
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346-93-164-41-013000Mill-Max |
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