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| Type | Description |
|---|---|
| Series: | 8060 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Transistor, TO-5 |
| Number of Positions or Pins (Grid): | 4 (Round) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polytetrafluoroethylene (PTFE) |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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20-823-90Aries Electronics, Inc. |
CONN IC DIP SOCKET 20POS GOLD |
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299-43-628-10-002000Mill-Max |
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714-43-164-31-018000Mill-Max |
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