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| Type | Description |
|---|---|
| Series: | 800 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 25.0µin (0.63µm) |
| Contact Material - Post: | Copper |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 105°C |
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|---|---|---|---|
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110-93-318-41-001000Mill-Max |
CONN IC DIP SOCKET 18POS GOLD |
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110-43-318-41-001000Mill-Max |
CONN IC DIP SOCKET 18POS GOLD |
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CONN IC DIP SOCKET 28POS GOLD |
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4-1571552-2TE Connectivity AMP Connectors |
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917-43-104-41-005000Mill-Max |
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123-87-316-41-001101Preci-Dip |
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4-1571552-4TE Connectivity AMP Connectors |
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110-43-316-10-003000Mill-Max |
CONN IC DIP SOCKET 16POS GOLD |
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110-43-210-10-002000Mill-Max |
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8444-11B1-RK-TP3M |
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