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| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | Transistor |
| Number of Positions or Pins (Grid): | 3 (Rectangular) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Board Guide, Flange |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS) |
| Operating Temperature: | -55°C ~ 175°C |
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