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67SLG040040025PI00

67SLG040040025PI00

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Manufacturer Part
67SLG040040025PI00
Manufacturer
Laird - Performance Materials
Description
METAL FILM OVER FOAM CONTACTS
Category
RF/IF and RFID
Family
RFI and EMI - Contacts, Fingerstock and Gaskets
Series
-
InStock
4814
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:SMD Grounding Metallized
Package:Tape & Reel (TR)Cut Tape (CT)
Part Status:Active
Type:Film Over Foam
Shape:Rectangle
Width:0.157" (4.00mm)
Length:0.098" (2.50mm)
Height:0.157" (4.00mm)
Material:Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating:-
Plating - Thickness:-
Attachment Method:Solder
Operating Temperature:-40°C ~ 70°C

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