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| Type | Description |
|---|---|
| Series: | WS300 |
| Package: | Bulk |
| Part Status: | Not For New Designs |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423°F (217°C) |
| Flux Type: | Water Soluble |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 17.64 oz (500g) |
| Shelf Life: | 6 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 35.6°F ~ 46.4°F (2°C ~ 8°C) |
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