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| Type | Description |
|---|---|
| Series: | HF250DP |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) |
| Diameter: | - |
| Melting Point: | 423°F (217°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Cartridge, 0.88 oz (25g) |
| Shelf Life: | - |
| Shelf Life Start: | - |
| Storage/Refrigeration Temperature: | - |
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