| Type | Description |
|---|---|
| Series: | 331 |
| Package: | Spool |
| Part Status: | Active |
| Type: | Wire Solder |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | 0.062" (1.57mm) |
| Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
| Flux Type: | Water Soluble |
| Wire Gauge: | 14 AWG, 16 SWG |
| Process: | Lead Free |
| Form: | Spool, 1 lb (454 g) |
| Shelf Life: | - |
| Shelf Life Start: | - |
| Storage/Refrigeration Temperature: | 50°F ~ 104°F (10°C ~ 40°C) |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
93-7069-9510Kester |
SN96.5AG3.0CU0.5 3.3%/268 .010 |
In Stock: 8 $107.36000 |
 |
SMD2040Chip Quik, Inc. |
SOLDER SPHERES SAC305 .020 DIAM |
In Stock: 3 $120.95000 |
 |
SMD2032Chip Quik, Inc. |
SOLDER SPHERES SN96.5/AG3.0/CU0. |
In Stock: 2 $122.95000 |
 |
SMD2028Chip Quik, Inc. |
SOLDER SPHERES SN96.5/AG3.0/CU0. |
In Stock: 4 $123.95000 |
 |
SMD2024Chip Quik, Inc. |
SOLDER SPHERES SN96.5/AG3.0/CU0. |
In Stock: 9 $124.95000 |
 |
SMD2020Chip Quik, Inc. |
SOLDER SPHERES SN96.5/AG3.0/CU0. |
In Stock: 6 $125.95000 |
 |
SMDLTLFP500T3CChip Quik, Inc. |
SOLDER PASTE LOW TEMP T3 500G |
In Stock: 3 $127.95000 |
 |
TS391SNL500CChip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
In Stock: 3 $128.25000 |
 |
70-4823-0910Kester |
NP560 SN96.5AG3.0CU0.5 T4 500 G |
In Stock: 19 $128.93000 |
 |
24-7150-9703Kester |
SOLDER FLUX-CORED/285 .015" 1LB |
In Stock: 11 $137.73000 |
