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| Type | Description |
|---|---|
| Series: | - |
| Package: | Jar |
| Part Status: | Active |
| Type: | Solder Paste, Two Part Mix |
| Composition: | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Diameter: | - |
| Melting Point: | 281°F (138°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 0.53 oz (15g) |
| Shelf Life: | 24 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 37°F ~ 77°F (3°C ~ 25°C) |
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|---|---|---|---|
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LF SOLDER WIRE 99.3/0.7 TIN/COPP |
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